IC a plastic future for smart clothing

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IBM has developed a technique that enables it to create high performance integrated circuits (ICs) on plastic substrates.

Previously, flexible circuits have had a limited performance threshold due to plastic substrates being incompatible with the harsh processes required to make high-performance CMOS devices.

However, IBM claims to have produced plastic SRAM. The extremely thin silicon on insulator (ETSOI) devices had a body thickness of just 60 angstroms.

The aim is to eventually develop wearable electronics, ultra lightweight biomedical devices and sensors.