Deal signed to create 'intelligent packaging' for perishables
By Jessica Holbrook, Plastics News
Posted 11 July 2012
Bemis, the largest flexible packaging company in the US, is teaming up with Norway's Thin Film Electronics to develop 'intelligent packaging' for perishable products.
The two firms have signed a joint development agreement to accelerate the commercial development of functional sensor labels made from Thin Film’s printed electronic technology.
The line of 'intelligent labels' will monitor, collect and wirelessly communicate the packaged products’ key physical and environmental data.
Thin Film said it had formed other technology partnerships to develop an “inexpensive, integrated inexpensive, integrated time-temperature sensor” for perishables and pharmaceuticals.
The company said its partnership with Bemis would extend this work in order to create a customisable sensor platform "that can be tailored to individual customer requirements". The Bemis Intelligent Packaging Platform should be commercially available by 2014.
“Intelligent packaging is an emerging technology with many potential intersections with Bemis’ flexible packaging and pressure sensitive materials business segments,” said Bemis president and chief executive Henry Theisen.
“Our agreement with Thin Film Electronics ASA is an investment in technology that could eventually make printed electronics a component of every package we manufacture.”
Thin Film, based in Oslo, Norway, said it was the first company to commercialise printed rewritable memory and is focused on developing printed products with memory, sensing, and wireless communication technology.
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